Browse editions

Current edition

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Shichun Qu, Yong Liu

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Shichun Qu, Yong Liu

322 pages • hardcover

nonfiction art science technology informative medium-paced

nonfiction art science technology informative medium-paced

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Shichun Qu, Yong Liu

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Shichun Qu, Yong Liu

322 pages • hardcover

nonfiction art science technology informative medium-paced

nonfiction art science technology informative medium-paced

Other editions (1)

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Shichun Qu, Yong Liu

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Shichun Qu, Yong Liu

322 pages • paperback (editions)

nonfiction art science technology informative medium-paced

nonfiction art science technology informative medium-paced

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Shichun Qu, Yong Liu

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Shichun Qu, Yong Liu

322 pages • paperback

nonfiction art science technology informative medium-paced

nonfiction art science technology informative medium-paced

More...